Wafer resistance: It is widely used in high-power equipment and is a new generation of surface mount circuit design. Combining high reliability and wafer leadless design, it is suitable for various mounting forms of AC and DC circuits.
Product Features: Using advanced thin film technology, it has the characteristics of high resistance accuracy, good heat dissipation, good stability, wide resistance range, high price ratio and so on.
Product scope of application: It is widely used in high-power equipment. It is a new generation of surface mount circuit design, combined with high reliability and wafer leadless design, and is suitable for various mounting forms of AC and DC circuits.
The Main Technical Indicators Of The Product
Rated Power | Resistance Range | Resistance Accuracy ± % |
Temperature Coefficient±PPM |
|
1/4W | 0Ω ~ 2M | 0.05、0.1、0.5、1、5 |
5、10、15、25、50、100 |
|
1/2W | 0Ω ~ 22M | |||
1W | ||||
2W |
||||
3W |
Dimensions And Parameters:
Results Of Solder Joint Size And Product Size:
Power Attenuation Curve And Coding Rules:
Test And Performance: